PCB Assembly

Zentech utilizes the latest in production technology to assemble your product efficiently and effectively. Our specialty is low to medium volume, high complexity and/or high reliability assemblies compliant with a wide range of standards including IPC 610 Class 2 and Class 3.

PCB Assembly Capabilities:

• Rosin, No Clean and Aqueous Flux Chemistries
• RoHs and Lead Only
• Three High Speed Juki lines
• 0201 SMT placement with Micro BGA to 2.5 mil ball diameter
• Automated SMT print inspection
• 13 Zone Reflow Ovens with 3 cool down zones (Great for heavier RF substrates)
• BGA X-Ray
• 3500W and 5000W Air Vac Rework Stations
• Multiple Through-hole Assembly Areas
• Automated Optical Inspection
• Conformal Coat
• Bonding and Underfill
• Potting
• ICT and Functional Test
• Box Build