CIRCUIT CARD
ASSEMBLY
Zentech utilizes the latest in production technology to assemble your product efficiently and effectively. Our specialty is low to medium volume, high complexity and/or high reliability assemblies compliant with a wide range of standards including IPC 610 Class 2 and Class 3.
SPECIFIC CAPABILITIES
SMT
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11 SMT Lines including Juki and Hanwha & Mycronic
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0201 SMT placement with Micro BGA to 2.5 mil ball diameter
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Leaded or non-leaded (ROHS)
Reflow Ovens
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13 Zone Reflow Ovens with 3 cool down zones (Great for heavier RF substrates)
Through Hole Assembly
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Zentech can support this older technology utilizing either manual insertion or semi-automated insertion equipment.
Cleaning
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Rosin, No Clean and Aqueous Flux Chemistries
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In-Line cleaning operations
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Effective for Bottom Terminated Components (BTC) and Low Profile Devices
Conformal Coat
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Acrylics, Polyurethanes, Silicone
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Manual & Automated
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Certified Operators
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Zentech Operators are certified to IPC 610 and J-STD-001
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Select Zentech employees are also Certified IPC Trainers
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New Product Introduction
The purpose of the NPI is to review customer requirements to create and incorporate the necessary manufacturing documents for sustained and effective product realization.
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NPI kick off meeting - discuss the customer requirements with Manufacturing Engineering, Quality, Configuration Control, and Purchasing teams.
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Technical Data Package review - manufacturing engineer reviews TDP and begins writing detailed assembly instructions and routers.
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NPI Lot Build - an initial build of a small quantity (5-10)
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Assembly Instructions and routers are finalized after NPI Lot Build